P01800 - SEMI P18 - Specification for Overlay Capabilities of Wafer Steppers StdPbc-0714 1 mmがすべての基板に適応する。

1 mmがすべての基板に適応する。

This Guide is intended to address the needs of the 3D Stacked IC (3DS-IC) industry by defining the items/parameters needed to procure virgin silicon carrier wafers to be used in a 3DS-IC process

本スタンダードは，global Silicon Wafer Committeeで技術的に承認されている。現版は2010年8月27日， global Audits & Reviews Subcommitteeにて発行が承認された。2010年10月にwww

with an MFC that has been equalized to ambient conditions for 24 hours before the application of power

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P01800 - SEMI P18 - Specification for Overlay Capabilities of Wafer Steppers StdPbc-0714 1 mmがすべての基板に適応する。NOTICE: This Standard or Safety Guideline has an Inactive Status because the conditions to maintain Current Status have not been met. Inactive Standards or Safety Guidelines are available from SEMI and continue to be valid for use. Definitions for the overlay capabilities of wafer steppers are established, consistent with the primary application of wafer stepper (i. e., the manufacturing of very large scale integrated circuits). Also included are